Electronic component package, oscillator, electronic apparatus, and base station

ABSTRACT

A package includes a base member and a first projecting portion that projects from one surface of the base member. The first projecting portion contacts a first substrate on which an electronic component is mounted, and has an insulating property.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation application of U.S. patentapplication Ser. No. 15/299,781, filed on Oct. 21, 2016, which claimspriority to Japanese Patent Application No. 2015-208666, filed Oct. 23,2015. The disclosures of each of the above are hereby incorporated byreference in their entireties.

BACKGROUND 1. Technical Field

The present invention relates to an electronic component package, anoscillator, an electronic apparatus, and a base station.

2. Related Art

In the related art, as an oscillator having highly accurate oscillationcharacteristics used for frequency control of a communication apparatusor the like for example, an oven controlled crystal oscillator (OCXO)including a resonator element that vibrates at a predetermined frequencyand configured to control the resonator element at a predeterminedtemperature, for example, has been known. According to such an ovencontrolled crystal oscillator, it is possible to output a signal at astable frequency without being affected by a change in outsidetemperature.

As one example of the oven controlled crystal oscillator, there is apiezoelectric oscillator disclosed in JP-A-2015-95790. The piezoelectricoscillator disclosed in JP-A-2015-95790 includes a package composed of alower lid cover having a plate shape and an upper lid cover having abottomed cylindrical shape, a circuit board provided within the package,and a resonator placed on the circuit board with a heating elementtherebetween and including a resonator element. In the piezoelectricoscillator disclosed in JP-A-2015-95790, the circuit board is connectedto the lower lid cover through lead terminals.

In the piezoelectric oscillator having such a configuration, when thecircuit board is connected to the lower lid cover through the leadterminals, the positioning of the circuit board with respect to thelower lid cover is not made. Therefore, the circuit board is disposedinclined to the lower lid cover for example, and as a result, a portionof the circuit board may come in contact with the lower lid cover.Therefore, in the related-art oscillator, the resonator element islikely to be affected by a change in temperature outside the package,and as a result, there is a problem in that frequency stability isdegraded.

SUMMARY

An advantage of some aspects of the invention is to provide anelectronic component package capable of reducing contact of a basemember with a first substrate, and also to provide an oscillator, anelectronic apparatus, and a base station each including the electroniccomponent package.

The advantage can be achieved by the following aspects of the invention.

An electronic component package according to an aspect of the inventionincludes a base member, and a first projecting portion projecting fromone surface of the base member, contacting a first substrate on which anelectronic component is mounted, and having an insulating property.

According to the electronic component package, the first projectingportion contacts the first substrate, so that a distance (gap) betweenthe first substrate and the base member can be defined to apredetermined interval, and thus, contact between the first substrateand the base member can be prevented or reduced. Therefore, since heatconduction between the base member and the first substrate can bereduced, it is possible to reduce the influence of a change intemperature outside the electronic component package on the electroniccomponent. As a result, the temperature control of the electroniccomponent can be performed with high accuracy.

In the electronic component package according to the aspect of theinvention, it is preferable that the electronic component packagefurther includes a second projecting portion projecting from the othersurface of the base member, contacting a second substrate above whichthe base member is mounted, and having an insulating property.

With this configuration, the second projecting portion contacts thesecond substrate, so that a distance (gap) between the second substrateand the base member can be defined to a predetermined interval, andthus, contact between the second substrate and the base member can beprevented or reduced. Therefore, heat conduction between the base memberand the second substrate can be reduced.

In the electronic component package according to the aspect of theinvention, it is preferable that a through-hole is provided in the basemember, and that the first projecting portion and the second projectingportion are configured integrally with a member penetrating thethrough-hole.

With this configuration, the first projecting portion and the secondprojecting portion can be collectively formed easily.

In the electronic component package according to the aspect of theinvention, it is preferable that the first projecting portion and thesecond projecting portion overlap in a plan view of the base member.

With this configuration, the design of the base member can befacilitated.

In the electronic component package according to the aspect of theinvention, it is preferable that the first projecting portion and thesecond projecting portion are provided at different positions in a planview of the base member.

With this configuration, a heat transfer path between the firstprojecting portion and the second projecting portion can be lengthened.Therefore, the transfer of heat between the inside and the outside ofthe electronic component package through the first projecting portionand the second projecting portion can be reduced.

In the electronic component package according to the aspect of theinvention, it is preferable that when the base member is viewed in aplan view, the area of the first projecting portion is smaller than thearea of the second projecting portion.

With this configuration, the contact area of the first projectingportion with the first substrate can be relatively reduced. Therefore,the transfer of heat from the base member to the first substrate throughthe first projecting portion can be further reduced.

In the electronic component package according to the aspect of theinvention, it is preferable that a projecting height of the firstprojecting portion is lower than a projecting height of the secondprojecting portion.

With this configuration, a distance between the first substrate and thebase member can be relatively shortened. Therefore, the low profile ofthe electronic component package can be achieved.

In the electronic component package according to the aspect of theinvention, it is preferable that the first substrate includes a recessor through-hole provided in a portion contacting the first projectingportion.

With this configuration, the distance between the first substrate andthe base member can be reduced, and thus, the low profile of the packagecan be achieved.

In the electronic component package according to the aspect of theinvention, it is preferable that at least one of the first projectingportion and the second projecting portion includes a surface having aspherical shape.

With this configuration, the contact area of the first projectingportion with the first substrate, or the contact area of the secondprojecting portion with the second substrate can be relatively reduced.Therefore, heat transfer between the first substrate and the base memberthrough the first projecting portion, or heat transfer between thesecond substrate and the base member through the second projectingportion can be further reduced.

In the electronic component package according to the aspect of theinvention, it is preferable that the electronic component packagefurther includes a pin penetrating the first substrate, electricallyconnected with the first substrate, and having conductivity, and thatthe first projecting portion and the pin support the first substratewith respect to the base member.

By electrically connecting the pin with, for example, the secondsubstrate, the first substrate and the second substrate can beelectrically connected.

Here, since the pin is configured to penetrate the first substrate, itis difficult to position with high accuracy the first substrate withrespect to the base member only by the pin. In contrast thereto, theelectronic component package according to the aspect of the inventionincludes the first projecting portion contacting the first substrate.Therefore, the first substrate can be positioned with high accuracy withrespect to the base member, and thus, contact of the first substratewith the base member can be reduced.

In the electronic component package according to the aspect of theinvention, it is preferable that the first projecting portion containsglass.

With this configuration, heat transfer between the first substrate andthe base member through the first projecting portion can be furtherreduced. Moreover, since the first projecting portion contains glass,the first projecting portion can be made relatively less deformable.Moreover, the first projecting portion having an insulating property canbe easily formed.

In the electronic component package according to the aspect of theinvention, it is preferable that the electronic component packageincludes at least three or more first projecting portions.

With this configuration, the posture of the first substrate with respectto the base member can be regulated with higher accuracy while reducingthe contact area of the first projecting portion with the firstsubstrate. Therefore, variations in the distance between the firstsubstrate and the base member can be reduced while reducing heatconduction between the first substrate and the base member.

An oscillator according to another aspect of the invention includes: theelectronic component package according to the aspect of the invention;the first substrate; a resonator provided on the first substrate andincluding a resonator element; and an oscillation circuit electricallyconnected to the resonator.

According to the oscillator, the electronic component package in whichcontact of the first substrate with the base member is reduced isincluded. Therefore, temperature fluctuation due to the contact betweenthe first substrate and the base member is reduced, and thus it ispossible to provide a highly stable oscillator with less change infrequency.

In the oscillator according to the aspect of the invention, it ispreferable that the oscillator further includes a temperature controlelement controlling the temperature of the resonator element.

With this configuration, the resonator element can be maintained at adesired temperature. In particular, when a reduced-pressure state isproduced within the electronic component package, temperaturefluctuation of the resonator element can be reduced to realize an ovencontrolled oscillator having excellent frequency stability.

An electronic apparatus according to still another aspect of theinvention includes the electronic component package according to theaspect of the invention.

According to the electronic apparatus, high reliability can be provided.

A base station according to further another aspect of the inventionincludes the electronic component package according to the aspect of theinvention.

According to the base station, high reliability can be provided.

BRIEF DESCRIPTION OF THE DRAWINGS

The various aspects of the invention will be described with reference tothe accompanying drawings, wherein like numbers reference like elements.

FIG. 1 is a cross-sectional view showing an oscillator including anelectronic component package according to a first embodiment of theinvention.

FIG. 2 is a plan view of the oscillator shown in FIG. 1.

FIG. 3 is a cross-sectional view showing a regulating member shown inFIG. 1.

FIG. 4 is a cross-sectional view showing a method for manufacturing theregulating member shown in FIG. 3.

FIG. 5 is a cross-sectional view showing a regulating member included inan electronic component package according to a second embodiment of theinvention.

FIG. 6 is a cross-sectional view showing a regulating member included inan electronic component package according to a third embodiment of theinvention.

FIG. 7 is a cross-sectional view showing an oscillator including anelectronic component package according to a fourth embodiment of theinvention.

FIG. 8 is a cross-sectional view showing a modified example of theelectronic component package according to the fourth embodiment of theinvention.

FIG. 9 is a cross-sectional view showing a portion of a first substrateincluded in an oscillator according to a fifth embodiment of theinvention.

FIG. 10 is a cross-sectional view showing a modified example of thefirst substrate included in the oscillator according to the fifthembodiment of the invention.

FIG. 11 is a perspective view showing the configuration of a mobile (ornotebook) personal computer to which an electronic apparatus accordingto the invention is applied.

FIG. 12 is a perspective view showing the configuration of a mobilephone (including a PHS) to which the electronic apparatus according tothe invention is applied.

FIG. 13 is a perspective view showing the configuration of a digitalstill camera to which the electronic apparatus according to theinvention is applied.

FIG. 14 is a perspective view showing an automobile to which a vehicleincluding the oscillator according to the invention is applied.

FIG. 15 is a schematic block diagram showing a positioning system towhich a base station according to the invention is applied.

DESCRIPTION OF EXEMPLARY EMBODIMENTS

Hereinafter, an electronic component package, an oscillator, anelectronic apparatus, and a base station according to the invention willbe described in detail based on preferred embodiments shown in theaccompanying drawings.

1. Oscillator First Embodiment

FIG. 1 is a cross-sectional view showing an oscillator including anelectronic component package according to a first embodiment of theinvention. FIG. 2 is a plan view of the oscillator shown in FIG. 1. FIG.3 is a cross-sectional view showing a regulating member shown in FIG. 1.FIG. 4 is a cross-sectional view showing a method for manufacturing theregulating member shown in FIG. 3. In the following, for convenience ofdescription, the upper side in FIG. 1 is referred to as “up”, and thelower side is referred to as “down”.

The oscillator 1 shown in FIG. 1 includes a package 2 (electroniccomponent package) including a base member 21 and a lid member 22, afirst substrate 3 (circuit board) provided in the package 2, a resonator4 provided above the first substrate 3 and including a resonator element42, and a plurality of circuit components 61. As shown in FIG. 1, theoscillator 1 is mounted for use on, for example, a second substrate 9 orthe like as a mounting board.

The oscillator 1 is an oven controlled crystal oscillator (OCXO), andconfigured to control the temperature of the resonator element 42 at apredetermined temperature. For this reason, the influence of a change inoutside temperature is small, so that it is possible to obtain an outputsignal with high frequency stability.

Hereinafter, the configuration of each part of the oscillator 1 will besuccessively described.

Package

The package 2 has a function of accommodating the first substrate 3, theresonator 4, and the plurality of circuit components 61.

As shown in FIG. 1, the package 2 includes the base member 21 having aplate shape and the lid member 22 having a bottomed cylindrical shape.Moreover, the package 2 includes a plurality of (four in the embodiment)pins 23 provided in the base member 21 and a plurality of (four in theembodiment) regulating members 7.

The lid member 22 is bonded to the base member 21 such that the openingof the lid member 22 is closed by the base member 21. With thisconfiguration, a space S1 in which the first substrate 3, the resonator4, and the plurality of circuit components 61 are accommodated isformed.

The base member 21 and the lid member 22 are airtightly bonded together.The space S1 may be in a reduced-pressure state, or an inert gas such asnitrogen, argon, or helium may be filled therein.

The method for bonding the base member 21 and the lid member 22 togetheris not particularly limited as long as the airtightness of the space S1can be ensured by the method. For example, examples of the bondingmethod include brazing, seam welding, and energy beam welding.

The constituent materials of the base member 21 and the lid member 22are not particularly limited, and for example, a resin material, aceramic material, a glass material, a metal material, or the like can beused.

Although not illustrated, the base member 21 may be provided with wires,electrodes, terminals, and the like that are electrically connected withthe pins 23.

Moreover, as described above, the package 2 includes the plurality of(four in the embodiment) pins 23 (lead terminals) and the plurality of(four in the embodiment) regulating members 7.

Each of the plurality of pins 23 has a long rod shape, penetrates thebase member 21 in the thickness direction thereof, and is fixed to thebase member 21. Moreover, each of the plurality of pins 23 penetratesthe second substrate 9 in the thickness direction thereof, and is fixedto the second substrate 9.

As shown in FIG. 2, the plurality of pins 23 are provided in theperipheral portion of the base member 21. In the embodiment, the basemember 21 has a quadrilateral shape in a plan view as viewed in thethickness direction thereof (a plan view of the base member 21), and theplurality of pins 23 are provided at the corner portions of the basemember 21.

The plurality of regulating members 7 will be described in detail later.

First Substrate

As shown in FIG. 1, the first substrate 3 (circuit board) is providedabove the base member 21. On the surface of the first substrate 3,wires, electrodes, and the like (not shown) are formed. The wires,electrodes, and the like are electrically connected with the pluralityof pins 23.

As shown in FIG. 2, the first substrate 3 has a quadrilateral shape in aplan view, and the plurality of pins 23 described above penetrate thecorner portions of the first substrate 3. Further, the first substrate 3and the second substrate 9 are electrically connected by means of theplurality of pins 23.

The constituent material of the first substrate 3 is not particularlylimited, and for example, a resin material, a ceramic material, a metalmaterial, or the like can be used. As the constituent material of thewires, electrodes, and the like (not shown) formed on the surface of thefirst substrate 3, for example, metal materials such as tungsten (W),molybdenum (Mo), nickel (Ni), and gold (Au) can be used alone or incombination of two or more.

Resonator

As shown in FIG. 1, the resonator 4 is supported to the first substrate3 through a plurality of lead frames 51.

The resonator 4 includes a package 41, the resonator element 42accommodated in the package 41, a temperature control element 43, and anintegrated circuit 44.

The package 41 includes a base body 411 having a box shape and includinga recess 414 opened in the upper surface, and a lid body 413 having aplate shape and bonded to the base body 411 through a seal ring 412 soas to close the opening of the recess 414. The recess 414 is closed bythe lid body 413, so that a space S2 in which the resonator element 42,the temperature control element 43, and the integrated circuit 44 areaccommodated is formed. The space S2 is in a reduced-pressure state.

Although not illustrated, wires, electrodes, and the like that areelectrically connected with the resonator element 42, the temperaturecontrol element 43, and the integrated circuit 44 are formed on the basebody 411.

The constituent materials of the base body 411 and the lid body 413 arenot particularly limited, and a resin material, a ceramic material, aglass material, or the like can be used.

The integrated circuit 44 is provided on the bottom surface of therecess 414. The integrated circuit 44 includes, for example, anoscillation circuit that oscillates the resonator element 42 and atemperature control circuit that controls the temperature controlelement 43.

The integrated circuit 44 is electrically connected to the wires,electrodes, and the like (not shown) formed on the base body 411described above.

In the embodiment, the integrated circuit 44 is provided in the interiorof the package 41 as described above; however, the integrated circuit 44may be provided outside the package 41.

The temperature control element 43 is provided on the base body 411. Thetemperature control element 43 has a function of controlling thetemperature of the resonator element 42 at a predetermined temperature.

The temperature control element 43 is, for example, a heat generatingIC, and includes a heat generating circuit and a temperature sensor. Theheat generating circuit is a circuit that generates heat in response toa current flowing into a resistor. The heat generating circuit may be anelement that generates heat in response to power input thereto, such asa power transistor. The temperature sensor is provided in proximity tothe resonator element 42, and outputs a signal according to temperature.The temperature sensor is composed of, for example, a diode or athermistor.

In the temperature control element 43, the heat generating circuit iscontrolled based on the signal from the temperature sensor by thetemperature control circuit (not shown) included in the integratedcircuit 44, so that the resonator element 42 is controlled at apredetermined temperature.

The temperature control element 43 is electrically connected to thewires, electrodes, and the like (not shown) formed on the base body 411described above.

The arrangement or the like of the temperature control element 43 is notlimited to that shown in the drawing as long as the temperature of theresonator element 42 can be controlled at a predetermined temperature.

The resonator element 42 is provided on the temperature control element43.

In the embodiment, an SC-cut quartz crystal resonator element is used asthe resonator element 42. With this configuration, the frequencystability of the oscillator 1 can be made particularly excellent. Theresonator element 42 is not limited to an SC-cut quartz crystalresonator element, and for example, any quartz crystal resonator elementsuch as an AT-cut quartz crystal resonator element or a BT-cut quartzcrystal resonator element may be used.

Although not illustrated, the resonator element 42 is provided withexcitation electrodes. The excitation electrodes are electricallyconnected to the wires, electrodes, and the like (not shown) formed onthe base body 411 described above.

Circuit Component

As shown in FIG. 1, the plurality of circuit components 61 are providedon the lower surface of the resonator 4 and the upper surface of thefirst substrate 3. The plurality of circuit components 61 are circuitconstituting members that constitute the oscillation circuit, thetemperature control circuit, and the like together with the integratedcircuit 44 described above. Examples of the circuit component 61include, for example, an IC, a resistance element, a capacitor element,and an inductor element.

The configuration of the oscillator 1 has been briefly described above.Next, the plurality of regulating members 7 included in the package 2described above will be described in detail.

Regulating Member

As described above, the package 2 includes the plurality of regulatingmembers 7 provided in the base member 21.

As shown in FIG. 1, each of the plurality of regulating members 7penetrates the base member 21 in the thickness direction thereof, and isfixed to the base member 21. Moreover, each of the plurality ofregulating members 7 is provided so as to contact the first substrate 3and the second substrate 9.

As shown in FIG. 2, the plurality of regulating members 7 are providedin the peripheral edge portion (corner portions in the embodiment) ofthe base member 21, and provided spaced apart from each other.

As shown in FIG. 3, the regulating member 7 includes a first projectingportion 71 that projects from the upper surface (one surface) of thebase member 21, a second projecting portion 72 that projects from thelower surface (the other surface) of the base member 21, and aconnection member 73 that connects the first projecting portion 71 andthe second projecting portion 72 together and is filled in athrough-hole 211 formed to penetrate the base member 21 in the thicknessdirection thereof.

The first projecting portion 71 and the second projecting portion 72,and the connection member 73 connecting the first and second projectingportions are integrally configured. Moreover, in the embodiment, thefirst projecting portion 71, the second projecting portion 72, and theconnection member 73 are configured of a material mainly containingglass, and have an insulating property.

The first projecting portion 71 has a shape such that the upper endportion of a hemisphere is cut off, an outer surface 711 of the firstprojecting portion 71 has a shape along a spherical surface (sphericalshape) except for the upper end, and the upper end is a flat surface.The first substrate 3 contacts the flat surface in the outer surface711. Since the portion contacting the first substrate 3 is a flatsurface, the first substrate 3 can be stably supported.

On the other hand, the second projecting portion 72 has ahemisphere-like shape, and an outer surface 721 of the second projectingportion 72 has a shape along a spherical surface (spherical shape). Thesecond substrate 9 contacts the lower end of the outer surface 721.

The first projecting portion 71 and the second projecting portion 72overlap in the plan view of the base member 21.

According to the regulating member 7 including the first projectingportion 71 and the second projecting portion 72, the base member 21 issupported to the second substrate 9, the first substrate 3 is supportedto the base member 21, and also, a distance between the base member 21and the second substrate 9 and a distance between the first substrate 3and the base member 21 can be regulated.

Specifically, since the package 2 includes the first projecting portion71 projecting from the upper surface of the base member 21, the firstprojecting portion 71 contacts the first substrate 3 when the firstsubstrate 3 is mounted on the base member 21. In this manner, the firstprojecting portion 71 contacts the first substrate 3, so that thedistance (gap) between the first substrate 3 and the base member 21 canbe defined to a predetermined interval. Therefore, contact between thefirst substrate 3 and the base member 21 can be prevented or reduced,and thus, heat conduction between the base member 21 and the firstsubstrate 3 can be reduced. With this configuration, since it ispossible to reduce the influence of a change in temperature outside thepackage 2 on the resonator 4 connected to the first substrate 3 throughthe lead frames 51, temperature control of the resonator element 42included in the resonator 4 can be performed with high accuracy. As aresult, the oscillator 1 can output a highly stable signal with lesschange in frequency.

Here, in the package 2 as described above, the first substrate 3 issupported to the base member 21 not only by the regulating members 7 butalso by the plurality of pins 23.

When the plurality of pins 23 are fixed to the base member 21 and thefirst substrate 3, the plurality of pins 23 are fixed to the base member21 for example, and thereafter, the pins 23 are inserted through thefirst substrate 3. In doing so, since the width of the pin 23 isconstant, the position of the first substrate 3 cannot be regulated. Ifit is intended to configure the pin 23 so as to be able to regulate theposition of the first substrate 3, processing is difficult.

In contrast thereto, the package 2 of the embodiment includes the firstprojecting portion 71 provided so as to contacts the first substrate 3,the first substrate 3 can be positioned with high accuracy with respectto the base member 21. Moreover, the formation of the regulating member7 is relatively easy as will be described later.

Moreover, the package 2 of the embodiment includes, in addition to thefirst projecting portion 71, the second projecting portion 72 projectingfrom the lower surface of the base member 21. Similarly to the firstprojecting portion 71, also the second projecting portion 72 is providedso as to contact the second substrate 9, unlike the pin 23 penetratingthe second substrate 9. Therefore, since the second projecting portion72 contacts the second substrate 9, the distance (gap) between thesecond substrate 9 and the base member 21 can be defined to apredetermined interval. For this reason, contact between the secondsubstrate 9 and the base member 21 can be prevented or reduced, andthus, heat conduction between the base member 21 and the secondsubstrate 9 can be reduced.

Moreover, as described above, the package 2 includes four firstprojecting portions 71, and the four first projecting portions 71 areprovided spaced apart from each other. Therefore, the posture of thefirst substrate 3 with respect to the base member 21 can be regulatedwith higher accuracy. Thus, variations in the distance between the firstsubstrate 3 and the base member 21 can be further reduced.

Similarly, the package 2 includes four second projecting portions 72,and the four second projecting portions 72 are provided spaced apartfrom each other. Therefore, the posture of the base member 21 withrespect to the second substrate 9 can be regulated with higher accuracywhile further reducing the contact area of the second projecting portion72 with the second substrate 9. For this reason, heat transfer betweenthe second substrate 9 and the base member 21 through the secondprojecting portion 72 can be further reduced, and also variations in thedistance between the second substrate 9 and the base member 21 can befurther reduced.

In the embodiment, the package 2 includes four first projecting portions71; however, advantageous effects equivalent to the advantageous effectsdescribed above can be provided as long as the package 2 includes atleast three first projecting portions 71. The same applies to the secondprojecting portion 72.

Further, as described above, the outer surface 721 of the secondprojecting portion 72 has a spherical shape (curved shape). With thisconfiguration, the contact area of the second projecting portion 72 withthe second substrate 9 can be further reduced. Therefore, the heattransfer between the second substrate 9 and the base member 21 throughthe second projecting portion 72 can be further reduced.

In the embodiment, the entire outer surface 721 of the second projectingportion 72 is of a spherical shape; however, advantageous effectsequivalent to the advantageous effects described above can be providedas long as at least a portion of the outer surface 721 contacting thesecond substrate 9 has a spherical shape even when the entire outersurface 721 is not of a spherical shape.

As shown in FIG. 3, a projecting height T1 of the first projectingportion 71 is smaller than a projecting height T2 of the secondprojecting portion 72. Therefore, the distance between the firstsubstrate 3 contacting the first projecting portion 71 and the basemember is shorter than the distance between the second substrate 9contacting the second projecting portion 72 and the base member 21. Withthis configuration, the distance between the first substrate 3 and thebase member 21 can be relatively shortened, and thus, the low profile ofthe package 2 can be achieved.

In the regulating member 7 as described above, the first projectingportion 71 and the second projecting portion 72 are configuredintegrally together with the connection member 73. For this reason, thefirst projecting portion 71 and the second projecting portion 72 can becollectively formed easily. Hence, the package 2 including the firstprojecting portion 71 and the second projecting portion 72 can bemanufactured more easily.

Moreover, the first projecting portion 71, the second projecting portion72, and the connection member 73 overlap in a plan view. For thisreason, the design of the base member 21 can be facilitated.

Moreover, as described above, the regulating member 7 is configured ofthe material mainly containing glass, and has an insulating property.Since the regulating member 7 has an insulating property, a shortcircuit among the first substrate 3, the base member 21, and the secondsubstrate 9 through the regulating member 7 can be prevented or reduced.Moreover, since the regulating member 7 is configured of the materialmainly containing glass, heat transfer among the first substrate 3, thebase member 21, and the second substrate 9 can be further reduced.Moreover, by the use of the material mainly containing glass, theregulating member 7 whose shape is less deformable can be formed.

In the embodiment, the regulating member 7 is configured of the materialmainly containing glass; however, the regulating member 7 is notparticularly limited as long as at least the surface has an insulatingproperty, and for example, the regulating member 7 may be configured ofa material mainly containing a resin material.

The regulating member 7 can be formed using, for example, two jigs 81and 82 shown in FIG. 4. One jig 81 of the two jigs 81 and 82 includes arecess 811 opened in the upper surface. The other jig 82 includes athrough-hole 821 penetrating the upper and lower surfaces.

First, the jigs 81 and 82 are disposed with respect to the base member21 so as to interpose the base member 21 therebetween such that therecess 811 of the jig 81 and the through-hole 821 of the jig 82 overlapthe through-hole 211 of the base member 21 in a plan view. Then, thematerial mainly containing glass is melted and put into a hole composedof the through-hole 821, the through-hole 211, and the recess 811, andthereafter, the material is hardened. With this configuration, theregulating member 7 including the first projecting portion 71, theconnection member 73, and the second projecting portion 72 integratedtogether can be formed.

When the regulating member 7 is formed as described above, the materialmainly containing glass is hardened on the through-hole 821 side in astate of being raised in a spherical shape due to surface tension.Therefore, according to the method described above, the secondprojecting portion 72 including a spherical shaped surface can be easilyformed.

On the other hand, on the recess 811 side, the material mainlycontaining glass is hardened in a state of following the flat bottomsurface of the recess 811. Thus, as shown in FIG. 3, the firstprojecting portion 71 having a spherical shape except for the upper endand having a flat surface at the upper end is formed.

In particular, by the use of the material mainly containing glass as thematerial constituting the regulating member 7, the first projectingportion 71 and the second projecting portion 72 including the sphericalshaped surface can be easily formed by the method described above.

Second Embodiment

Next, a second embodiment of the invention will be described.

FIG. 5 is a cross-sectional view showing a regulating member included inan electronic component package according to the second embodiment ofthe invention.

The electronic component package according to the embodiment is similarto the embodiment described above except that the configuration of theregulating member is different.

In the following description, the second embodiment will be describedmainly on differences from the embodiment described above, and thedescription of similar matters is omitted. In FIG. 5, configurationssimilar to those of the embodiment described above are denoted by thesame reference signs and numerals.

In the regulating member 7A included in the package 2A shown in FIG. 5,the configurations of a first projecting portion 71A and the secondprojecting portion 72 are substantially equivalent to each other.

Specifically, an entire outer surface 711A of the first projectingportion 71A has a spherical shape, and the projecting height T1 of thefirst projecting portion 71A and the projecting height T2 of the secondprojecting portion 72 are substantially equivalent to each other.

In the embodiment, since the outer surface 711A of the first projectingportion 71A has a spherical shape similarly to the outer surface 721 ofthe second projecting portion 72, the contact area of the firstprojecting portion 71A with the first substrate 3 can be furtherreduced. Therefore, the heat transfer between the first substrate 3 andthe base member 21 through the first projecting portion 71A can befurther reduced.

In the embodiment, the entire outer surface 711A of the first projectingportion 71A is of a spherical shape; however, advantageous effectsequivalent to the advantageous effects described above can be providedas long as a portion of the outer surface 711A contacting the firstsubstrate 3 has at least a spherical shape even when the entire outersurface 711A is not of a spherical shape.

In the formation of the first projecting portion 71A in which the entireouter surface 711A has a spherical shape, a jig (not shown) that isrecessed in a spherical shape may be used instead of the jig 81 (the jig81 including the recess in which the bottom surface is a flat surface)used in the first embodiment.

Also according to the package 2A, the contact of the first substrate 3with the base member 21 can be reduced.

Third Embodiment

Next, a third embodiment of the invention will be described.

FIG. 6 is a cross-sectional view showing a regulating member included inan electronic component package according to the third embodiment of theinvention.

The electronic component package according to the embodiment is similarto the embodiments described above except that the configuration of theregulating member is different.

In the following description, the third embodiment will be describedmainly on differences from the embodiments described above, and thedescription of similar matters is omitted. In FIG. 6, configurationssimilar to those of the embodiments described above are denoted by thesame reference signs and numerals.

In the regulating member 7B included in the package 2B shown in FIG. 6,the area of a first projecting portion 71B is smaller than the area ofthe second projecting portion 72 in the plan view of the base member 21.Moreover, compared with the projecting height T1 of the first projectingportion 71 in the first embodiment, the projecting height T1 of thefirst projecting portion 71B in the embodiment is further lowered.

The first projecting portion 71B is located at the central portion ofthe connection member 73 in a plan view.

By further reducing the area of the first projecting portion 71B in theplan view as described above, the curvature radius can be furtherreduced, and thus, the contact area of the first projecting portion 71Bwith the first substrate 3 can be relatively reduced. Therefore, theheat transfer between the first substrate 3 and the base member 21through the first projecting portion 71B can be further reduced.

Moreover, by further lowering the projecting height T1 of the firstprojecting portion 71B, the lower profile of the package 2B can beachieved.

Also according to the package 2B, the contact of the first substrate 3with the base member 21 can be reduced.

Fourth Embodiment

Next, a fourth embodiment of the invention will be described.

FIG. 7 is a cross-sectional view showing an oscillator including anelectronic component package according to the fourth embodiment of theinvention. FIG. 8 is a cross-sectional view showing a modified exampleof the electronic component package according to the fourth embodimentof the invention.

The electronic component package according to the embodiment is similarto the embodiments described above except that the configuration of aregulating member is different.

In the following description, the fourth embodiment will be describedmainly on differences from the embodiments described above, and thedescription of similar matters is omitted. In FIGS. 7 and 8,configurations similar to those of the embodiments described above aredenoted by the same reference signs and numerals.

The package 2C included in the oscillator 1C shown in FIG. 7 includes aplurality of (four in the embodiment) first regulating members 7C1 and aplurality of (four in the embodiment) second regulating members 7C2.

The plurality of first regulating members 7C1 and the plurality ofsecond regulating members 7C2 are provided in the peripheral edgeportion of the base member 21 (specifically the corner portions of thebase member 21).

The first regulating member 7C1 includes a first projecting portion 71Cand a filling member 74 filled in a through-hole 211C formed topenetrate the base member 21 in the thickness direction thereof. Thefirst projecting portion 71C and the filling member 74 are integrallyconfigured.

The second regulating member 7C2 includes a second projecting portion72C and a filling member 75 filled in a through-hole 211C formed topenetrate the base member 21 in the thickness direction thereof. Thesecond projecting portion 72C and the filling member 75 are integrallyconfigured.

In the package 2C as described above, the first projecting portion 71Cand the second projecting portion 72C are provided at differentpositions in the plan view of the base member 21. For this reason, aheat transfer path between the first projecting portion 71C and thesecond projecting portion 72C can be lengthened. Therefore, the transferof heat between the inside and the outside of the package 2C through thefirst projecting portion 71C and the second projecting portion 72C canbe reduced.

The arrangement of the first projecting portions 71C and the secondprojecting portions 72C is not limited to the arrangement shown in FIG.7, and for example, the first projecting portions 71C and the secondprojecting portions 72C may be arranged as shown in FIG. 8. That is, thefirst projecting portion 71C may be provided at the corner portion ofthe base member 21, and the second projecting portion 72C may beprovided between two adjacent corner portions of the base member 21 (amidpoint of a portion along a side of the peripheral portion).

Also according to the package 2C, the contact of the first substrate 3with the base member 21 can be reduced.

Fifth Embodiment

Next, a fifth embodiment of the invention will be described.

FIG. 9 is a cross-sectional view showing a portion of a first substrateincluded in an oscillator according to the fifth embodiment of theinvention. FIG. 10 is a cross-sectional view showing a modified exampleof the first substrate included in the oscillator according to the fifthembodiment of the invention.

The oscillator according to the embodiment is similar to that of theembodiments described above except that the configuration of the firstsubstrate is different.

In the following description, the fifth embodiment will be describedmainly on differences from the embodiments described above, and thedescription of similar matters is omitted. In FIG. 9, configurationssimilar to those of the embodiments described above are denoted by thesame reference signs and numerals.

In the first substrate 3D included in the oscillator 1D shown in FIG. 9,a recess 31 is formed in a portion that the regulating member 7Acontacts. The recess 31 has a shape corresponding to the upper endportion of the first projecting portion 71A. For this reason, when thefirst substrate 3D is mounted on the base member 21 included in thepackage 2A, the upper end portion of the first projecting portion 71A isdisposed in the recess 31. With this configuration, a distance betweenthe first substrate 3D and the base member 21 can be further reduced,and thus, the low profile of the package 2A can be further achieved.

In the above, an example in which the recess 31 is formed in the firstsubstrate 3D has been described; however, for example, instead of therecess 31, a through-hole that is opened in both the upper and lowersurfaces of the first substrate 3D may be formed in the first substrate3D. Moreover, in the above, the recess 31 is of a shape corresponding tothe upper end portion of the first projecting portion 71A; however, theshape of the recess 31 is not limited to this.

For example, as shown in FIG. 10, a through-hole 32 having a smallerarea than the first projecting portion 71A in a plan view may be formedin the first substrate 3D. In this case, a portion around thethrough-hole 32 contacts the first projecting portion 71A. With thisconfiguration, a contact area between the first substrate 3D and thefirst projecting portion 71A can be reduced. Therefore, the transfer ofheat from the first substrate 3D to the base member can be furtherreduced. Moreover, compared with the formation of the recess 31, theformation of the through-hole 32 is easier.

2. Electronic Apparatus

Next, an electronic apparatus including the oscillator according to theinvention will be described.

FIG. 11 is a perspective view showing the configuration of a mobile (ornotebook) personal computer to which the electronic apparatus accordingto the invention is applied.

In this drawing, the personal computer 1100 is composed of a main bodyportion 1104 including a keyboard 1102, and a display unit 1106including a display 1108. The display unit 1106 is rotatably supportedto the main body 1104 through a hinge structure. The oscillator 1including the package 2 (electronic component package) is incorporatedinto the personal computer 1100.

FIG. 12 is a perspective view showing the configuration of a mobilephone (including a PHS) to which the electronic apparatus according tothe invention is applied.

In this drawing, the mobile phone 1200 includes an antenna (not shown),a plurality of operation buttons 1202, an earpiece 1204, and amouthpiece 1206. A display 1208 is disposed between the operatingbuttons 1202 and the earpiece 1204. The oscillator 1 including thepackage 2 (electronic component package) is incorporated into the mobilephone 1200.

FIG. 13 is a perspective view showing the configuration of a digitalstill camera to which the electronic apparatus according to theinvention is applied.

A display 1310 is provided on the back of a case (body) 1302 in thedigital still camera 1300, and configured to perform display based onimaging signals generated by a CCD. The display 1310 functions as afinder that displays a subject as an electronic image. Moreover, on thefront side (the rear side in the drawing) of the case 1302, a lightreceiver 1304 including an optical lens (imaging optical system) and theCCD is provided. When a photographer confirms the subject imagedisplayed on the display 1310 and presses down a shutter button 1306,imaging signals of the CCD at the time are transferred to and stored ina memory 1308. The oscillator 1 including the package 2 (electroniccomponent package) is incorporated into the digital still camera 1300.

The electronic apparatus includes the oscillator 1 including the package2 (electronic component package), and therefore has excellentreliability.

In addition to the personal computer in FIG. 11, the mobile phone inFIG. 12, and the digital still camera in FIG. 13, the electronicapparatus according to the invention can be applied to, for example, asmartphone, a tablet terminal, a watch (including a smartwatch), aninkjet ejection device (e.g., an inkjet printer), a laptop personalcomputer, a television set, a wearable terminal such as a head-mounteddisplay (HMD), a video camcorder, a videotape recorder, a car navigationsystem, a pager, an electronic notebook (including one withcommunication function), an electronic dictionary, a calculator, anelectronic gaming machine, a word processor, a workstation, avideophone, a surveillance television monitor, electronic binoculars, aPOS terminal, a medical device (e.g., an electronic thermometer, asphygmomanometer, a blood glucose meter, an electrocardiogram measuringsystem, an ultrasonic diagnosis apparatus, and an electronic endoscope),a fishfinder, various types of measuring instrument, an apparatus for amobile terminal base station, indicators (e.g., indicators used in avehicle, aircraft, and a ship), a flight simulator, and a networkserver.

3. Vehicle

Next, a vehicle including the oscillator according to the invention willbe described.

FIG. 14 is a perspective view showing an automobile to which the vehicleincluding the oscillator according to the invention is applied.

The automobile 1500 shown in FIG. 14 includes a vehicle body 1501 andfour wheels 1502, and is configured so as to rotate the wheels 1502 witha not-shown power source (engine) provided in the vehicle body 1501. Theoscillator 1 including the package 2 (electronic component package) isincorporated into the automobile 1500.

The oscillator 1 can be widely applied to an electronic control unit(ECU) such as, for example, a keyless entry system, an immobilizer, acar navigation system, a car air-conditioner, an anti-lock brake system(ABS), an air bag, a tire pressure monitoring system (TPMS), enginecontrol, a battery monitor of a hybrid vehicle or an electrical vehicle,and a vehicle body posture control system. By incorporating theoscillator 1 including the package 2 (electronic component package) intothe automobile 1500, the automobile 1500 with high reliability isobtained.

4. Base Station

Next, a base station including the oscillator according to the inventionwill be described.

FIG. 15 is a schematic block diagram showing a positioning system towhich the base station according to the invention is applied.

The positioning system 100 shown in FIG. 15 includes a GPS satellite200, a base station 300, and a GPS receiver 400.

The GPS satellite 200 transmits positioning information (GPS signal).

The base station 300 includes a receiver 302 that receives positioninginformation with high accuracy from the GPS satellite 200 through anantenna 301 provided at, for example, an electronic reference point (GPScontinuous observation station), and a transmitter 304 that transmitsthe positioning information received by the receiver 302 through anantenna 303.

Here, the receiver 302 included in the base station 300 is an electronicdevice including, as a reference frequency oscillation source, theoscillator 1 including the package 2 (electronic component package)described above. The receiver 302 has excellent reliability. Moreover,the positioning information received by the receiver 302 is transmittedin real time by the transmitter 304.

The GPS receiver 400 includes a satellite receiver 402 that receives thepositioning information from the GPS satellite 200 through an antenna401, and a base-station receiver 404 that receives the positioninginformation from the base station 300 through an antenna 403.

The electronic component package, the oscillator, the electronicapparatus, and the base station according to the invention have beendescribed above based on the embodiments shown in the drawings. However,the invention is not limited to them. The configuration of each part canbe replaced with any configuration having a similar function. Moreover,any other components may be added to the invention. Moreover, theinvention may be a combination of any two or more of the configurations(features) of the embodiments.

What is claimed is:
 1. An oscillator comprising: a first substrate; aresonator mounted on the first substrate; a package accommodating thefirst substrate and including: a base member; a first projecting portionprojecting from a surface of the base member and contacting the firstsubstrate, the first projecting portion having an insulating property;and a pin penetrating the base member and being electrically connectedto the first substrate, wherein the first projecting portion and the pinsupport the first substrate relative to the base member.
 2. Theoscillator according to claim 1, wherein the first substrate is disposedbetween the resonator and the base member.
 3. The oscillator accordingto claim 1, wherein in a plan view, the area of the first projectingportion is less than that of the base member.
 4. The oscillatoraccording to claim 1, wherein the package further includes a secondprojecting portion projecting from another surface of the base member.5. The oscillator according to claim 4, wherein the first projectingportion and the second projecting portion are configured integrally witha member penetrating a through-hole provided in the base member.
 6. Theoscillator according to claim 4, wherein the first projecting portionand the second projecting portion overlap each other in a plan view ofthe base member.
 7. The oscillator according to claim 4, wherein thefirst projecting portion and the second projecting portion are providedat different positions in a plan view of the base member.
 8. Theoscillator according to claim 4, wherein when the base member is viewedin a plan view, the area of the first projecting portion is smaller thanthe area of the second projecting portion.
 9. The oscillator accordingto claim 4, wherein a projecting height of the first projecting portionis lower than a projecting height of the second projecting portion. 10.The oscillator according to claim 1, wherein the first substrateincludes a recess or through-hole provided in a portion contacting thefirst projecting portion.
 11. The oscillator according to claim 4,wherein at least one of the first projecting portion and the secondprojecting portion includes a surface having a spherical shape.
 12. Theoscillator according to claim 1, wherein the first projecting portioncontains glass.
 13. The oscillator according to claim 1, comprising atleast three of the first projecting portions.
 14. The oscillatoraccording to claim 1, further comprising: a temperature control elementthat controls the temperature of the resonator.
 15. An electronicapparatus comprising the oscillator according to claim
 1. 16. A basestation comprising the oscillator according to claim 1.